IS200VTCCH1CBB 可以接受多达24个热电偶输入

IS200VTCCH1CBB 可以接受多达24个热电偶输入

IS200VTCCH1CBB 是通用电气为其 Mark VI 系统设计的热电偶输入板。  Mark VI 专为管理燃气轮机和蒸汽轮机而设计。 该系统设计为可扩展用于大型和小型涡轮机设置。  Mark VI 的硬件和软件在设计时考虑到了的涡轮机性能，并且专为这些最终用途而设计。 该系统为关键控制提供三重冗余备份。 这通常发生在控制模块中，该模块连接到 HMI/操作员界面，允许用户访问系统数据、警报状态和维护工具。

IS200VTCCH1CBB标有94VO、E99006、Type 6、2606等多个代码，单板和前面板均标有GE标志。 前面板使用螺钉连接连接到 PCB 上，包括三个 LED 组件，这些组件在电路板的顶部边缘附近相互堆叠。

IS200VTCCH1CBB 接受 E、J、K、S 和 T 型热电偶。 这些可以接地或不接地。 热电偶距离控制柜最远可达三百米。 双向电缆电阻为 450 Ω。  被视为“超出硬件限制”的热电偶将从扫描输入中取出，以防止该数据影响其他输入。

IS200VTCCH1CBB 有两个背板（P1 和 P2）和四个其他连接器。 该板有电感线圈或磁珠（L1 到 L19）。 它还具有 TP 测试点、二极管、电阻器和电容器。 位于板上的集成电路包括 Xilinx Spartan XCS30 FPGA、IDT S35J 双端口 SRAM 芯片、DSP TMS320C32PCMA50 数字串行处理器和 IDT S15Y CMOS 静态 RAM 芯片。

IS200VTCCH1CBB 可以接受多达24个热电偶输入

The IS200VTCCH1CBB is a thermocouple input board designed by General Electric for its Mark VI system. The Mark VI is designed for the management of gas and steam turbines. The system is designed to be scalable for both large and small turbine Settings. The Mark VI hardware and software are designed with turbine performance in mind and are designed for these end uses. The system provides triple redundant backup for critical controls. This usually occurs in the control module, which is connected to the HMI/ operator interface, allowing users to access system data, alert status, and maintenance tools.

The IS200VTCCH1CBB is marked with 94VO, E99006, Type 6, and 2606 codes. The board and front panel are marked with GE marks. The front panel is attached to the PCB using screw connections and consists of three LED components that stack on top of each other near the top edge of the board.

The IS200VTCCH1CBB accepts type E, J, K, S and T thermocouples. These can be grounded or ungrounded. The thermocouple can be up to 300 meters away from the control cabinet. The bidirectional cable resistance is 450 Ω. Thermocouples that are deemed "out of hardware limits" will be taken out of the scan input to prevent that data from affecting other inputs.

The IS200VTCCH1CBB has two backplanes (P1 and P2) and four other connectors. The board has inductive coils or magnetic beads (L1 to L19). It also has TP test points, diodes, resistors and capacitors. The integrated circuit located on the board includes Xilinx Spartan XCS30 FPGA, IDT S35J dual-port SRAM chip, DSP TMS320C32PCMA50 digital serial processor and IDT S15Y CMOS static RAM chip.