VE3008 CE3008系列KJ2005X1-MQ1 12P6381X042控制器管理模块

VE3008 CE3008系列KJ2005X1-MQ1 12P6381X042控制器管理模块

奔腾Pro(高达512 KB高速缓存)封装在陶瓷多芯片模块(MCM)中。MCM包含两个下侧空腔，微处理器管芯及其配套的高速缓存管芯位于其中。管芯被结合到散热片上，其暴露的顶部有助于来自管芯的热量更直接地传递到冷却装置，例如散热器。使用传统的引线键合将管芯连接到封装。空腔用陶瓷板盖住。

具有1 MB高速缓存的奔腾Pro使用塑料MCM。不是两个空腔，而是只有一个空腔，三个芯片位于其中，与封装结合，而不是散热块。这些空腔用环氧树脂填充。

MCM有387个引脚，其中大约一半排列在引脚栅格阵列(PGA)中，另一半排列在间隙引脚栅格阵列(IPGA)中。包装是为插座8。

The Pentium Pro(up to 512 KB cache) is packaged in a ceramic multi-chip module (MCM). The MCM consists of two lower cavities in which the microprocessor core and its accompanying cache core are located. The tube core is bonded to the heat sink, and its exposed top helps the heat from the tube core to be transferred more directly to the cooling device, such as the radiator. The tube core is connected to the package using traditional lead bonding. The cavity is covered with a ceramic plate.

The Pentium Pro with 1 MB cache uses plastic MCM. Instead of two cavities, there is only one cavity, with three chips located in it, combined with the package instead of the cooling block. These cavities are filled with epoxy resin.

The MCM has 387 pins, about half of which are arranged in a pin grid array (PGA) and the other half in a gap pin grid array (IPGA). Packing is for socket 8.