霍尼韦尔honeywell板卡模块CC-PAIM01优势

霍尼韦尔honeywell板卡模块CC-PAIM01优势

模块间通讯 是通过Honeywell模块间各HIGHWAY进行的，OM模块间是XPR卡通过System HIGHWAY实现的，OM与PM模块通信是XPR卡通过Process HIGHWAY实现的，PM 与I/O通信是由PM的UIX卡通过IOHIGHWAY连接到I/O IOC卡实现的。

总线介质通常为冗余同轴电缆，总线通信速率1.2或4Mbit/s。总线又分为系统总线，过程总线和I/O总线。总线两端为75欧姆终端电阻，当怀疑总线故障时可以断开所有模块测量并联电阻在40欧姆左右（线阻50-100欧姆/千米）。

Communication between modules is carried out through various highways between Honeywell modules; communication between OM modules is realized by XPR card through System HIGHWAY; communication between OM and PM modules is realized by XPR card through Process HIGHWAY. PM and I/O communication is achieved by connecting the PM's UIX card to the I/O IOC card via IOHIGHWAY.

The bus medium is usually redundant coaxial cable, and the bus communication rate is 1.2 or 4Mbit/s. The bus is divided into system bus, process bus and I/O bus. The bus has 75 ohm terminal resistance at both ends, and all modules can be disconnected when a bus fault is suspected. The parallel resistance is measured at about 40 ohm (line resistance 50-100 ohm/km).