LAM 810-073479-215 接口板模块 电源控制板

LAM 810-073479-215 接口板模块 电源控制板

线路板按层数来分的话分为单面板，双面板,和多层线路板三个大的分类。

首先是单面板，在最基本的PCB上，零件集中在其中- -面， 导线则集中在另- -面上。因为导线只出现在其中一面， 所以就称这种PCB叫作单面线路板。单面板通常制作简单，造价低，但是缺点是无法应用于太复杂的产品_上。

双面板是单面板的延伸，当单层布线不能满足电子产品的需要时，就要使用双面板了。双面都有覆铜有走线，并且可以通过过孔来导通两层之间的路，使之形成所需要的网络连接。

多层板是指具有三层以上的导电图形层与其间的绝缘材料以相隔层压而成，且其间导电图形按要求互连的印制板。多层线路板是电子信息技术向高度、多功能、大容量、小体积、薄型化、轻量化方向发展的产物。

线路板按特性来分的话分为软板(FPC)，硬板(PCB), 软硬结合板(FPCB)。

FR-1:

阻燃覆铜箔酚醛纸层压板。IPC4101详细规范编号02;Tg N/A;

FR-4: 1)阻燃覆铜箔环氧E玻纤布层压板及其粘结片材料。IPC4101详细规范编号21;Tg≥100°C;

2)阻燃覆铜箔改性或未改性环氧E玻纤布层压板及其粘结片材料。IPC4101详细规范编号 24;:Tg 150°C~ 200°C;

3)阻燃覆铜箔环氧/PPO玻璃布层压板及其粘结片材料。IPC4101详细规范编号 25;Tg 150°C~200°C;

4)阻燃覆铜箔改性或未改性环氧玻璃布层压板及其粘结片材料。IPC4101详细规范编号26;Tg 170°C~220°C;

LAM 810-073479-215 接口板模块 电源控制板

The circuit board is divided into three large categories according to the number of layers: single panel, double panel, and multi-layer circuit board.

The first is a single panel, in the most basic PCB, the parts are concentrated in one side, the wire is concentrated in the other side. Because the wire only appears on one side, this PCB is called a single-sided circuit board. Single panel is usually simple to make, low cost, but the disadvantage is that it can not be applied to too complex products.

Dual panel is an extension of the single panel, when the single-layer wiring can not meet the needs of electronic products, it is necessary to use dual panel. Both sides are covered with copper and have a path, and the path between the two layers can be guided through the hole to form the required network connection.

Multilayer board refers to a printed board with more than three layers of conductive graphics layer and the insulating material between them are separated by layers, and the conductive graphics between them are interconnected according to requirements. Multilayer circuit board is the product of the development of electronic information technology to the direction of height, multi-function, large capacity, small volume, thin shape and light weight.

According to the characteristics of the circuit board is divided into soft board (FPC), hard board (PCB), soft and hard combined board (FPCB).

FR-1:

Flame retardant copper-clad phenolic paper laminate. IPC4101 Specification Number 02; Tg N/A;

FR-4: 1) Flame retardant copper clad epoxy E glass fiber cloth laminate and adhesive sheet material. IPC4101 Detail Specification Number 21; Tg≥100°C;

2) Flame retardant copper clad modified or unmodified epoxy E glass fiber cloth laminate and its adhesive sheet material. IPC4101 Detail Specification No. 24; :Tg 150°C~ 200°C;

3) Flame retardant copper clad foil epoxy /PPO glass cloth laminate and its adhesive sheet material. IPC4101 Detail Specification No. 25; Tg 150°C~200°C;

4) Flame retardant copper clad foil modified or unmodified epoxy glass cloth laminate and its bonding sheet material. IPC4101 Detail Specification Number 26; Tg 170°C~220°C;