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LAM系列810-234640-312应用半导体控制板块多选择工业模块

LAM系列810-234640-312应用半导体控制板块多选择工业模块品牌LAM产品特性原装保障是否进口否产地美国加工定制否工作电压标准VV输出频率标准kHz产品认证原厂系列LAM物料编码半导体板卡可售卖地全国型号810-234640-312LAM系列810-234640-312应用半导体控制板块多选择工业模块1 CPU插座:是主板上最显眼的插座,其颜色一般为白色,上面布满了一个个的“针孔”或“触

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LAM系列810-234640-312应用半导体控制板块多选择工业模块

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LAM系列810-234640-312应用半导体控制板块多选择工业模块

1 CPU插座:是主板上最显眼的插座,其颜色一般为白色,上面布满了一个个的“针孔”或“触脚”,而且边上还有一个拉杆,对应CPU的接口方式。

内存插槽:一般位于CPU特座的旁边,它是板上必不可少的插槽,前且每块主板都有两到三个内存插槽。目前的主流内存有3种,而这3种内存条的引脚,工作电压,性能都不相同。


因此与之配套的内存插槽也不尽相同。从外观上来看主要是长度,隔断有很大的区别,其中SDRAM与DDR SDRAM的插槽长度一样,但SDRAM有两个隔断,而DDR只有一个隔断。至于RDRAM插槽,其隔断也有两个,但两个都位于插槽中央,左右是对称的。


提示:DDR-2是由JEDEC,电子元件工业联合会制定的内存标准。工业标准的内战通常指的是符合JEDEC标准的一组内存。JEDEC定义的全新的下一代DDR内存技术标准,在INTEL的BTX规格的代号ALDERWOOD的I915P芯片组和代号GRANTSDALE的I925芯片组中被完全支持。


2 总线扩展槽:在主板上占用面积最大的部件就是总线扩展槽。用于扩展电脑功能的插槽通常称为I/O插槽,大部分主板都有1~8个扩展槽。扩展槽是总线的延伸,也是总线的物理体现。在它上面可以插入任意的标准元件,如显卡,声卡,网卡,多功能卡等。


3 BIOS芯片:中文意思是“基本输入输出系统”。需要注意的是,BIOS实际上是电脑中最底层的一种程序,它一般固化在一块ROM芯片中。这块芯片包含了系统启动程序,基本的硬件接口设备驱动程序。BIOS为电脑提供最低级的。最直接的硬件控制,电脑的原始操作都是依照固化在BIOS中的程序来完成的。当系统启动时,BIOS进行通电自检,检查系统基本部件,然后系统启动程序将系统的配置参数写入CMOS中。

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LAM系列810-234640-312应用半导体控制板块多选择工业模块

1 CPU socket: is the most prominent socket on the motherboard, its color is generally white, it is covered with a "pinhole" or "foot", and there is a pull rod on the side, corresponding to the interface of the CPU.

Memory slot: Generally located next to the CPU special seat, it is an essential slot on the board, and each motherboard has two to three memory slots. At present, there are 3 kinds of mainstream memory, and the pins, operating voltage, and performance of these 3 kinds of memory are different.


Therefore, the corresponding memory slot is not the same. From the appearance point of view is mainly length, partition has a big difference, which SDRAM and DDR SDRAM slot length is the same, but SDRAM has two partitions, and DDR only one partition. As for the RDRAM slot, there are also two partitions, but both are located in the center of the slot and are symmetrical left and right.


Note: DDR-2 is a memory standard developed by JEDEC, the Federation of Electronic Component Industries. The civil war of industry standards usually refers to a set of memory that conforms to the JEDEC standard. The new, next-generation DDR memory technology standard defined by JEDEC is fully supported in INTEL's BTX specification I915P chipset code-named ALDERWOOD and I925 chipset code-named GRANTSDALE.


2 Bus expansion slot: The component that occupies the largest area on the motherboard is the bus expansion slot. The slots used to expand the functions of the computer are often called I/O slots, and most motherboards have 1 to 8 expansion slots. The expansion slot is an extension of the bus and a physical embodiment of the bus. Any standard components can be inserted on it, such as video card, sound card, network card, multi-function card, etc.


3 BIOS chip: Basic Input/Output System. It should be noted that the BIOS is actually a program at the lowest level of the computer, and it is generally solidified in a ROM chip. This chip contains the system boot program, the basic hardware interface device driver. The BIOS provides the lowest level for a computer. The most direct hardware control, the original operation of the computer is done in accordance with the program solidified in the BIOS. When the system is started, the BIOS performs a power-on self-test to check the basic components of the system, and then the system startup program writes the configuration parameters of the system into the CMOS.



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