5SHX2645L0004 ABB 可控硅 晶闸管/二极管模块 

5SHX2645L0004 ABB 可控硅 晶闸管/二极管模块 

SEMIS仿真结果是基于时间的带有算术值的图表。半导体损耗被分析计算为开关损耗和导通损耗。它们也出现在转换器层面，说明了所有元件的总损耗。在结果中也有输入功率的情况下，SEMIS计算总半导体损耗为转换器吸收功率的百分比。以这种方式，用户得到半导体选择对转换器的整体效率的影响的指示。

半导体结温度Tj是包括在允许评估操作的热极限的结果中的另一个参数。如果超过了结温度Tj的允许限值，或者如果施加的电压超出了要模拟的产品的推荐限值，则会提示警报消息。由于SEMIS基于PLECS仿真软件，HiPak、StakPak、二极管和IGCT热模型（XML格式）可从我们的网站下载，因此PLECS用户可以使用它们自行准确地模拟ABB产品。 

所有晶闸管/二极管模块均采用行业标准外壳，设计用于非常低的损耗和最高的工作温度。典型的应用是交流电机软起动器、变速驱动器和可再生能源。来自大功率半导体的特性用于ABB的中等功率模块。这些功能确保了在负载循环下的最高性能、更高的热利用率、增加的过载能力等优势。

ABB半导体公司的SPT（Soft Punch Through）芯片组及其具有较低损耗的改进型（SPT+和SPT++）可在1200 V和1700 V下使用。由于芯片收缩适度，因此与其他芯片相比，它们具有最高的每额定安培输出功率，因此芯片面积更大。

1200V的典型应用是用于工业驱动器、太阳能、电池备份系统（UPS）和电动车辆的功率转换器。1700伏的应用还包括工业电力转换和驱动、风力涡轮机和牵引变流器。

ABB的1700 V SPT++芯片组是世界上第一个提供高达175°C的工作结温度的1700 V芯片组。这允许模块设计者显著地增加IGBT模块的功率密度。

5SHX2645L0004 ABB 可控硅 晶闸管/二极管模块 

SEMIS simulation results are time-based graphs with arithmetic values. Semiconductor losses are analyzed and calculated as switching losses and on-off losses. They also appear at the converter level and indicate the total loss of all components. In cases where there is also input power in the result, SEMIS calculates the total semiconductor loss as a percentage of the power absorbed by the converter. In this way, the user is given an indication of the effect of semiconductor selection on the overall efficiency of the converter.

The semiconductor junction temperature Tj is another parameter included in the results that allows evaluation of the thermal limit of the operation. If the allowable limit of the closure temperature Tj is exceeded, or if the applied voltage exceeds the recommended limit of the product to be simulated, an alert message is prompted. Since SEMIS is based on PLECS simulation software, HiPak, StakPak, diode and IGCT thermal models (in XML format) are available for download from our website, so PLECS users can use them to accurately simulate ABB products themselves.

All thyristor/diode modules feature industry standard housing designed for very low losses and the highest operating temperatures. Typical applications are AC motor soft starters, variable speed drives, and renewable energy. Features from high-power semiconductors are used in ABB's medium power modules. These features ensure maximum performance under load cycles, higher heat utilization, increased overload capacity, and more.

ABB Semiconductor's Soft Punch Through (SPT) chipset and its lower loss variants (SPT+ and SPT++) are available at 1200 V and 1700 V. Due to the moderate chip shrinkage, they have the highest output power per rated amp compared to other chips, so the chip area is larger.

Typical applications for 1200V are power converters for industrial drives, solar power, battery backup systems (UPS), and electric vehicles. Applications for 1700 volts also include industrial power conversion and drive, wind turbines and traction converters.

ABB's 1700 V SPT++ chipset is the world's first 1700 V chipset to offer an operating junction temperature of up to 175°C. This allows module designers to significantly increase the power density of IGBT modules.