ABB 216EA62 1MRB150083R1/F 1MRB178066R1/F自动化控制系统CPU模块

ABB 216EA62 1MRB150083R1/F 1MRB178066R1/F自动化控制系统CPU模块

ABB 216EA62 1MRB150083R1/F 1MRB178066R1/F自动化控制系统CPU模块

216EA62和IP双P/T模块之间。在这些条件下，观察到入口和出口空气之间的温度上升了10℃。70°C出口空气温度（60°C进气），设备的连接温度计算MVME162（根据测量的案例温度），并进行了验证不超过100°C。注意：对于高温操作，用户必须执行类似的测量和计算，以确定存在于特定环境中。

以下是用户可以采取的一些步骤，以帮助实现升温操作：1.将MVME162板放置在机箱中，以在机箱上获得最大气流电路板的组件侧。仅使用低功耗IP模块。IP模块的首选位置是位置a（J2和J3）和位置d（J18和J19）。

通讯委员会规章MVME162进行了测试，没有使用工业包装并满足A级设备的要求。FCC合规性在以下条件下实现：所有外部输入/输出端口上的屏蔽电缆。通过金属外壳连接器连接至接地的电缆屏蔽连接至导电模块前面板。导电底盘导轨接地。这提供了将屏蔽连接到接地的路径。

前面板螺钉正确拧紧。对于最小射频发射，必须满足上述条件已实施。如果不这样做，可能会影响FCC对包含模块的设备概述MVME162是配备MC68LC040的双高VMEmodule或可选MC68040微处理器。（MC68040微处理器具有浮点协处理器；MC68LC040没有。）MVME162具有1MB、4MB或8MB奇偶校验保护DRAM；512KBSRAM（带备用电池）；

TOD时钟（带备用电池）；可选带有DMA的LAN以太网收发器接口，两个串行端口（EIA-232-D和EIA-232-D/EIA-530）；六个带看门狗定时器的滴答定时器；可选择的SCSI总线与DMA的接口；VMEbus接口（本地总线到VMEbus/VMEbus到本地总线，具有A16/A24/A32、D8/D16/D32总线宽度和VMEbus系统控制器）。

ABB 216EA62 1MRB150083R1/F 1MRB178066R1/F自动化控制系统CPU模块

216Between the EA62 and the IP dual P/T module. Under these conditions, the temperature between the inlet and outlet air was observed to rise by 10 ° C. The 70°C outlet air temperature (60°C intake), the device's connection temperature is calculated MVME162 (based on the measured case temperature) and is verified not to exceed 100°C. Note: For high-temperature operations, the user must perform similar measurements and calculations to determine the presence in a particular environment.

Here are some steps the user can take to help achieve the heating operation: 1. Place the MVME162 board in the case to obtain the component side of the board with maximum airflow on the case. Only low-power IP modules are used. The preferred positions for IP modules are positions a (J2 and J3) and d (J18 and J19).

The Communications Commission Regulation MVME162 was tested without industrial packaging and meets the requirements for Class A equipment. FCC compliance is achieved under the following conditions: Shielded cables on all external input/output ports. Cable shields connected to the ground through metal housing connectors connect to the conductive module front panel. Conductive chassis guide is grounded. This provides a path to connect the shield to the ground.

Screws on the front panel are properly tightened. For minimum RF emission, the above conditions must be fulfilled. Failure to do so may affect the FCC's overview of devices that include modules The MVME162 is either a dual-height VMEmodule equipped with the MC68LC040 or an optional MC68040 microprocessor. (The MC68040 microprocessor has a floating-point coprocessor; MC68LC040 No.) The MVME162 has 1MB, 4MB or 8MB parity-protected DRAM; 512KBSRAM with spare battery;