ABB AIM0006 2RCA021397A0001P 控制模块备件

ABB AIM0006 2RCA021397A0001P 控制模块备件

ABB AIM0006 2RCA021397A0001P 控制模块备件

这些组件几乎总是包含一个中央处理机(CPU)，记忆片内接口输入/输出设备，输入/输出接口，以及辅助存储器接口，通常与其他组件一起，例如无线电调制解调器和一个图形处理单元(GPU)–全部在单个基质或者微芯片。

它可能包含数字的，还有模拟的,混合信号，而且经常无线电频率 信号处理功能(否则它可能被认为只是一个应用处理器)。

更高性能的SOC通常与专用且物理上分离的存储器和辅助存储(例如LPDDR和eUFS或者eMMC分别是)芯片，这些芯片可以层叠在SoC的顶部，被称为包装上的包装(PoP)配置，或者靠近SoC放置。此外，SOC可以使用单独的无线调制解调器。

ABB AIM0006 2RCA021397A0001P 控制模块备件

These components almost always consist of a central processing unit (CPU), in-chip interface input/output devices, input/output interfaces, and auxiliary memory interfaces, often together with other components such as a radio modem and a graphics processing unit (GPU) - all in a single substrate or microchip.

It may contain digital, as well as analog, mixed-signal, and often radio-frequency signal processing capabilities (otherwise it might be considered just an application processor).

Higher performance SOCs are typically paired with dedicated and physically separate memory and secondary storage (e.g. LPDDR and eUFS or eMMC respectively) chips that can be stacked on top of the SoC in what is known as a pack-in-a-package (PoP) configuration, or placed close to the SoC. In addition, the SOC can use a separate wireless modem.